APX300-DM Plasma Dicer

APX300-DM Plasma Dicer

SKU:

  • NM-EFE3AA/NM-EFE3AA-D
Featured Specs

Plasma dicing is becoming increasingly attractive in the semiconductor market. Dies are becoming smaller and thinner and manufacturers are facing difficulties such as increasing material loss due to the width of the dicing line, mechanical damage to the dies from chipping and increasingly longer processing times due to line-by-line mechanical dicing.

The Panasonic Connect APX300-DM Plasma Dicer solves these challenges and simultaneously provides a higher quality product with a lower cost of production. Ideal for thin, brittle, and ultra-thin wafers; a damage-free, particle-free, stress-free and high die strength non-contact dicing and enabling ultra-narrow 20μm dicing street. Up to 300mm wafer and patented tape and frame protection from effects of plasma during dicing.

  • Single chamber to scalable Cluster chamber option
  • Particle-free and damage-free process
  • Higher chip strength and yield improvements
  • The Panasonic APX300 is CE certified

  1. For other size wafers, please contact us

  2. 2 line 3-phase power source, and this shows the total

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