MD-P200US2 Ultrasonic Bonder
The Panasonic Connect MD-P200 is a high-productivity die bonder. The synchronous head system offers unparalleled productivity, providing results that surpass conventional die bonders. The wafer supply, pre-centering, bond head and dispenser work in parallel to achieve high-throughput.
The MD-P200 solves today's need for small and thin die bonding and offers capabilities for tomorrow's challenges as well. Accurate die pre-centering ensures minimal die tilt and a novel ejector design handles thin dies. Functionality for multi-die packages is also available.
- Wafer mapping software capability
- Low bond force option
- Epoxy writing or pin transfer
- High accuracy
- Flexible for multiple die
Featured Specs
| SKU | NM-EFF1D |
|---|---|
| Model ID | MD-P200US2 |
| Model No. | NM-EFF1D |
| Productivity * | 0.65 s / IC for thermosonic bonding (Including process time of 0.2 seconds. Under the fastest conditions) [*1] |
| Placement Accuracy * | XY (3 at PFSC conditions) : ±5 µm [*1] |
| Substrate Dimensions (mm) | L 50 × W 30 to L 120 × W 120 |
| Die Dimensions (mm) | L 0.25 × W 0.25 to L 6 × W 6 |
| Number of Die Types | 1 product type (manual wafer supply) / Up to 12 product types (AWC specifications) |
| Die Supply | Wafer frame (Max. 8 inch) , Tray |
| Bonding Load | VCM head for thermosonic process : 1 N to 50 N (Option : 2 N to 100 N) |
| Head Heating | Up to 300℃ for the VCM head |
| Substrate Heating * | Constant heating, Up to 300℃ |
| Power Source * | 3-phase AC 200 V ±10V, 50 / 60 Hz, |
| Pneumatic Source | 0.4 to 0.5 Mpa (Max. 0.8 Mpa), 30 L / min (A.N.R.) (Up to 150 L / min for full-featured machine including cooling air) |
| Dimensions (mm) | W 1,340 × D 1,140 × H 1,400 (Including loader/unloader) |
| Mass | 1,750 kg (Including loader / unloader) |