MD-P200 Die Bonder
The Panasonic Connect MD-P200 is a high-productivity die bonder. The synchronous head system offers unparalleled productivity, providing results that surpass conventional die bonders. The wafer supply, pre-centering, bond head and dispenser work in parallel to achieve high-throughput.
The MD-P200 solves today's need for small and thin die bonding and offers capabilities for tomorrow's challenges as well. Accurate die pre-centering ensures minimal die tilt and a novel ejector design handles thin dies. Functionality for multi-die packages is also available.
- Real time US monitoring function realizes stable quality by monitoring process parameters during production
- Wafer mapping software capability
- Low bond force option
- Epoxy writing or pin transfer
- Various advanced software functions (option) will fulfill various requirement, depending on purposes
Featured Specs
| SKU | NM-EFF1B |
|---|---|
| Model ID | MD-P200 |
| Model No. | NM-EFD1B |
| Productivity * | 0.56 s / IC（Under the fastest conditions） 0.75 s / IC for thermosonic bonding（Including process time of 0.2 seconds. Under the fastest conditions) [*1] |
| Placement Accuracy * | XY（3σ at PFSC conditions）： ±7 μm（Flip bonding）, ±15 μm（With pre-centering）, ±25 μm（Direct bonding) {*1] |
| Substrate Dimensions (mm) | L 50 × W 30 to L 280 × W 140（For thermosonic : L 200 × W 150 ) |
| Die Dimensions (mm) | L 0.25 × W 0.25 to L 6 × W 6 |
| Number of Die Types | Up to 12 types（For AWC）/ UP to 10 types（Tray with the palette changer）/ Up to 5 types（Wafer frame with the palette changer) |
| Die Supply | Wafer frame, Pre-expanded ring, Tray |
| Adhesive Dispenser | Air-powered writing, Stamping pin |
| Bonding Load | Pneumatic head : 0.5 N to 10 N（Option : 1 N to 50 N） VCM head for thermosonic process : 1 N to 50 N（Option : 2 N to 100 N) |
| Head Heating | Constant heating, Up to 250℃ for the pneumatic head, Up to 300℃ for the VCM head |
| Substrate Heating | Constant heating, Up to 300℃ |
| Number of Nozzles | Up to 24 nozzles（Pickup nozzle, Bonding nozzle, Stamping tool）（Not available for the thermosonic nozzle) |
| Power Source * | 3-phase AC 200 V ±10V, 50 / 60 Hz, Up to 4 kVA（Up to 7 kVA for heating specification) [*2] |
| Pneumatic Source | 0.5 MPa, 30 L / min（A.N.R.）（Up to 150 L / min for full-featured machine including cooling air) |
| Dimensions (mm) | Standard specification（Up to 200 mm substrate length. Including loader/unloader） W 1,950 × D 1,190 × H 1,720 (Machine body : W 1,190 × D 1,190 × H 1,720) |
| Mass | 2,200 kg（Including loader / unloader |