MD-P300 Flip Chip Bonder
The Panasonic Connect process-flexible, MD-P300 flip chip bonder combines flip chip, thermosonic, and thermocompression bonding in a single, small footprint solution.
Flexible bonding tools change from thermosonic to C4 to TCB processes directly. It also supports 300mm (12") wafer substrates. The MD-P300 is an ideal solution for COB hybrid assembly with an in-line Panasonic SMT placement machine.
Fast cycle times and placement accuracy of +/-5μm at 0.5 seconds per IC (dry run)—with thermosonic and C4 processes at 0.65 seconds, including process times.
- Real-time inspection allows you to realize higher manufacturing accuracy
- Process versatility
- Ideal for processors and CMOS and MEMS power devices
- Bonding processes are available by switching the bonding tools, which can be done under the configuration of C4 dipping unit
- Bonding stage camera enables post-bonding inspection right after the die bonding. (OP)
Featured Specs
| SKU | NM-EFF1C |
|---|---|
| Model ID | MD-P300 |
| Model No. | NM-EFF1C |
| Productivity * | C4 : 0.65s/IC (including dipping motion) Thermosonic : 0.65s/IC (including US process time of 0.2s) [*1] |
| Placement Accuracy * | XY (3 at PFSC conditions) : ±5 µm [*1] |
| Substrate Dimensions (mm) | L 50 × W 50 to L 330 × W 330 (Heating specifications : L 330 × W 220 mm) |
| Die Dimensions (mm) | L 1 × W 1 to L 25 × W 25 ( Thermosonic : L7 × W 7) |
| Number of Die Types | Up to 12 product types (AWC specifications) *1 nozzle type |
| Die Supply | Wafer frame 12 inches (Option : 8 inches) |
| Bonding Load | VCM head : 1N to 50 N (Option : 2 N to 100 N) |
| Head Heating | Thermosonic : Up to 300℃ |
| Substrate Heating * | Constant heating, Up to 200℃ (Heating bonding stage specifications : Max. substrate size L 330 × W 220 mm) [*2] |
| Power Source * | 3-phase AC 200V ± 10V, 50/60 Hz, Up to 4 kVA (Up to 7 kVA for heating specification) [*3] |
| Pneumatic Source | 0.4 Mpa, 50L/min(A.N.R.) (Up to 150 L/min for full-featured machine including cooling air) |
| Dimensions (mm) | W 1,380 × D 1,640 × H 1,430 ( without loader / unloader) |
| Mass | 2,300 kg ( without loader / unloader) |